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GIGABYTE Extends USB 3.0 Leadership at CES 2010
Wednesday, 06 January 2010 15:28

GIGABYTE TECHNOLOGY Co., Ltd, a leading manufacturer of motherboards, graphics cards and other computing hardware solutions is pleased to announce that they will focus on new USB 3.0 SuperSpeed products at CES this year with compatible 3rd party device demos and the introduction of the GA-H57M-USB3 and GA-H55M-USB3 motherboards.

These new motherboards are based on yet to be announced chipsets from Intel® and increase GIGABYTE’s range of SuperSpeed USB 3.0 motherboards to an unequalled 13 models. Cementing the company’s leadership in the onboard USB 3.0 motherboard market, GIGABYTE plans to introduce a further 11 motherboard models before the end of January 2010. An extensive list of available and ‘coming soon’ GIGABYTE USB 3.0 products is available here.

“We expect USB 3.0 to be a very hot topic at CES this year and it’s really exciting to see all the new applications and devices that have already been preannounced by the media and CES organizers,” commented Tony Liao, Associate VP for North American Sales and Marketing at GIGABYTE Technology Co. Ltd. “With our aggressive USB 3.0 motherboard roadmap and top-to-bottom range of solutions, we are ready to partner-up with every USB 3.0 device vendor in ensuring complete compatibility with GIGABYTE motherboards.”

GIGABYTE will demonstrate their market leading USB 3.0 motherboards and compatible 3rd party SuperSpeed devices at a party at the Palms Place Hotel and Spa, The Palms Las Vegas on January 6th starting at 7:45 PM. USB motherboards and 3rd party devices will also be on display at the GIGABYTE meeting rooms at the Venetian Hotel, Renaissance Suite from January 6th-9th.

For additional information about the GIGABYTE USB 3.0 motherboards, please visit the GIGABYTE website at: or